机读格式显示(MARC)
- 000 01001nam0 2200277 450
- 100 __ |a 20231011d2023 ekmy0chiy50 ea
- 200 1_ |a 基于MAGSAC++算法的贴片机BGA物料配准方法及应用 |A Ji Yu Magsac++ Suan Fa De Tie Pian Ji Bga Wu Liao Pei Zhun Fang Fa Ji Ying Yong |d = Method and Application of BGA Material Alignment for Bonder Based on MAGSAC++ Algorithm |f 张越 |g 指导老师:陶俊 |z eng
- 215 __ |a 67页 |c 图 |d 29cm
- 328 __ |a 学位论文(硕士)--江汉大学,2023
- 500 10 |a Method and Application of BGA Material Alignment for Bonder Based on MAGSAC++ Algorithm |m chi
- 606 __ |a 计算机技术 |A Ji Suan Ji Ji Shu |j 学位论文
- 701 _0 |a 张越 |A Zhang Yue |4 著
- 702 _0 |a 陶俊 |A Tao Jun |4 指导
- 801 _0 |a CN |b JHUD |c 20231102
- 905 __ |a JHUD |d N533:TP3/21