机读格式显示(MARC)

• 000 01001cam a2200301 a 4500

• 001 0000695418

• 003 CAL

• 005 20100919144600.0

• 008 020215s2002 nyua b 001 0 eng

• 010 __ |a 2002022737

• 020 __ |a 0071378820 (alk. paper)

• 040 __ |a DLC |c DLC |d YDX |d UKM

• 042 __ |a pcc

• 050 00 |a TK7870 |b .E4424 2002

• 082 00 |a 621.381 |2 21

• 090 __ |a TN605/E38

• 093 __ |a TN605 |2 4

• 099 __ |a CAL 022005105146

• 245 00 |a Electronic assembly fabrication : |b chips, circuit boards, packages, and components / |c Charles A. Harper, editor-in-chief.

• 260 __ |a New York : |b McGraw-Hill, |c c2002.

• 300 __ |a xv, 672 p. : |b ill. ; |c 24 cm.

• 440 _0 |a McGraw-Hill professional engineering

• 440 _0 |a Electronic packaging and interconnection series

• 504 __ |a Includes bibliographical references and index.

• 650 _0 |a Electronic apparatus and appliances |x Design and construction.

• 700 1_ |a Harper, Charles A.

• 920 __ |a 242450 |z 2

• 950 __ |a JHUD |b TN605 |c E38