MARC状态:审校 文献类型:西文图书 浏览次数:24
- 题名/责任者:
- Electronic assembly fabrication : chips, circuit boards, packages, and components / Charles A. Harper, editor-in-chief.
- 出版发行项:
- New York : McGraw-Hill, c2002.
- ISBN:
- 0071378820 (alk. paper)
- 载体形态项:
- xv, 672 p. : ill. ; 24 cm.
- 附加个人名称:
- Harper, Charles A.
- 论题主题:
- Electronic apparatus and appliances-Design and construction.
- 中图法分类号:
- TN605
- 书目附注:
- Includes bibliographical references and index.
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